Vertiv has unveiled the VertivTM CoolLoop Trim Cooler, designed to support both air and liquid cooling applications for artificial intelligence (AI) and high-performance computing (HPC).
“Asia’s rapid digital transformation and AI-driven growth demand innovative cooling solutions that can handle high heat densities while improving energy efficiency. The VertivTM CoolLoop Trim Cooler is ideal for the region’s diverse climate conditions, providing scalable, high-density cooling that reduces energy use and operational complexity. This future-friendly solution enables our customers to support AI and HPC infrastructure strategies while achieving significant space savings and simplifying installation,” said Chee Hoe Ling, vice president of product management Asia at Vertiv.
VertivTM CoolLoop Trim Cooler
The VertivTM CoolLoop Trim Cooler champions energy efficiency by boasting up to a 70% annual cooling energy consumption reduction. It achieves this through a clever combination of free cooling and mechanical operation.
This innovative system also saves 40% of space compared to traditional systems, supporting fluctuating supply water temperatures up to 40°C and a cold plate functionality at 45°C.
The VertivTM CoolLoop Trim Cooler is designed with scalability in mind. It utilises a low-GWP refrigerant and offers a scalable cooling capacity of up to nearly 3 MW in the air-cooled configuration. This adaptability makes it suitable for businesses of various sizes and needs.
The system is also designed to operate in free cooling mode across a wider range of seasons and conditions, reducing electrical consumption and CO2e emissions.
